Mixed alloy solder paste

ABSTRACT

A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.12/772,897 filed on May 3, 2010, which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present invention relates generally to solder compositions, and moreparticularly, some embodiments relate to solder compositions for hightemperature solder joint applications.

DESCRIPTION OF THE RELATED ART

Lead generated by disposal of electronic assemblies is consideredhazardous to the environment and human health. Regulations increasinglyprohibit the use of Pb-bearing solders in the electronic interconnectionand the electronic packaging industries. Pb-free solders to replace thetraditional eutectic Pb—Sn have been widely investigated. SnAg, SnCu,SnAgCu and SnZn solders are becoming the mainstream solders forinterconnection in the semiconductor and electronics industries.However, the development of high temperature Pb-free solders tosubstitute the conventional high lead ones, i.e. Pb-5Sn & Pb-5Sn-2.5Ag,is still in its infancy. High temperature solders are used to keep theinternal connection within the components in an assembly when theassembly is being soldered onto a printed wiring board (PWB).

A common use of high temperature solder is for die-attach. In an exampleprocess, the assembly is formed by soldering a silicon die onto alead-frame using the high temperature solder. Then, the silicondie/lead-frame assembly, either encapsulated or not, is attached ontoPWB by soldering or mechanical fastening. The board may be exposed to afew more reflow processes for surface mounting other electronic devicesonto the board. During the further soldering processes, the internalconnection between the silicon die and the lead-frame should be wellmaintained. This requires that the high temperature solder resist themultiple reflows without any functional failure. Accordingly, in orderto be compatible with solder reflow profiles used in the industry, themajor requirements for the high temperature solders include (i) amelting temperature around 260° C. and above (in accordance with typicalsolder reflow profiles), (ii) good thermal fatigue resistance, (iii) thehigh thermal/electric conductivity, and (iv) low cost.

Currently, there are no drop-in lead-free alternatives available in theindustries. However, a few lead-free solder candidates have beenproposed recently for the high temperature die-attach applications, suchas (1) Sn—Sb, (2) Zn-based alloys, (3) Au—Sn/Si/Ge and (4) Bi—Ag.

Sn—Sb alloys, with less than 10 wt % Sb, maintain good mechanicalproperties without forming massive intermetallic compounds. But theirsolidus temperature is no higher than 250° C., which can not satisfy the260° C. requirement for reflow resistance.

Zn-based alloys, including eutectic Zn—Al, Zn—Al—Mg, and Zn—Al—Cu, havemelting temperature above 330° C. However, the high affinity of Zn, Al,and Mg to oxygen causes extremely poor wetting on various metallizationsurface finishes. Zn—(20-40 wt %) Sn solder alloys, proposed to be oneof the high temperature lead-free substitute solder, have liquidustemperature above 300° C., but the solidus temperature is only around200° C. The semi-solid state of Zn—Sn solder at around 260° C. issupposed to maintain a good interconnection between the componentsduring subsequent reflows. However, problems arise when the semi-solidsolder is compressed inside an encapsulated package and forces thesemi-solid solder to flow out. This creates a risk of unexpectedfunctional failure. Zn-based solder alloys will also form massive IMClayers between the metallization surface and the solder. The existenceof the IMC layer and its intensive growth during the subsequent reflowand operation also causes reliability concerns.

Eutectic Au—Sn, composed of two intermetallic compounds, has beenexperimentally shown to be a reliable high temperature solder because ofits melting temperature of 280° C., good mechanical properties, highelectrical & thermal conductivities, and excellent corrosion resistance.However, extremely high cost restricts its application within the fieldswhere cost overcomes reliability considerations.

Bi—Ag alloys with solidus temperature of 262° C. satisfy the meltingtemperature requirement for high temperature die-attach solders.However, there are a few major concerns: (1) poor wetting on varioussurface finishes and (2) the associated weak bonding interfaceoriginating from the poor wetting.

The melting temperature requirement for high melting lead-free soldersmakes Sn—Sb and Zn—Sn solders unsuitable. The extremely high cost of Aurich solders limits their acceptance by the industry. Zn—Al and Bi—Agmeet the melting temperature requirement and are reasonably low-cost.However, their poor wetting, due to high affinity to oxygen (in theZn—Al solder system) or due to poor reaction chemistry between thesolder and the substrate metallization (in the Bi—Ag solder system oreven some lead-containing solders such as the Pb—Cu and Pb—Ag systems),makes these high melting solders hard to use in the industry because ofthe weak bonding strength resulting from the poor wetting. However, thedesired high melting temperature of BiAg and ZnAl still make themeligible as candidates for the high temperature lead-free solders.

As described above, the poor wetting of a solder originates from (1)poor reaction chemistry or (2) the oxidation of the solder. Weak bondingis always associated with the poor wetting. For example, the poorwetting of Bi-based solder on different metallization surfaces resultsmainly from the poor reaction chemistry between Bi and the substratematerials (i.e. Cu) or the oxidation of Bi during reflow. Ge-doped BiAgaimed at preventing the excessive formation of dross on alloy surfaceduring melting have been developed. However, this doping will not changethe reaction chemistry between Bi and the metallization surface finishof the substrate. Bi and Cu will not form IMCs at a Bi/Cu interface,which is the dominant reason for the poor wetting and the weak bondinginterface. Bi and Ni will form IMC layer between a Bi/Ni interface, butthe brittle IMCs (Bi3Ni or BiNi) weaken the joint strength becausecracks always grow along either the interface between Bi3Ni and thesolder matrix or the interface between BiNi and the Ni substrate.Accordingly, the reaction chemistry between Bi and substrate materialsresult in the poor wetting and the weak bonding strength.

Attempts have been made to modify the reaction chemistry between solderalloy and the metallization surface finish by alloying additionalelements in the solder. However, alloying is normally associated withsome unexpected property loss. For example, Sn has a better reactionchemistry with substrates than comparing to Bi. However, directlyalloying Sn into BiAg (where the Ag is aimed at increasing thethermal/electrical conductivity) could cause (1) significant decrease inthe melting temperature or (2) the formation of Ag3Sn IMC in the alloy.This will not improve the reaction chemistry between Sn with substratemetals if there is no enough time for them to be dissolved in the moltensolder during reflow. Thus, alloying elements directly into solder, suchas Sn directly into Bi—Ag alloys, reveal minimal improvements.

BRIEF SUMMARY OF EMBODIMENTS OF THE INVENTION

The present invention claims a new technology for designing andpreparing mixed alloy solder pastes, which deliver the combined meritsfrom the constituent alloy powders. In some embodiments, the mixed alloysolder pastes are suitable for high-temperature solder applications suchas die attach because the constituents provide the desired meritsincluding improved reaction chemistry, well-controlled IMC layerthickness, and the enhanced reliability accordingly from the secondalloy and the high melting temperature and good thermal/electricalconductivity from the first alloy. The invention also presents themethod of preparing the mixed alloy solder pastes and the methodology ofjoining the electronic components or mechanical parts with the mixedalloy solder pastes.

The invented technology provides a method of designing mixed alloypowder pastes, in which the additive powders are present in the paste toimprove the reaction chemistry at a relatively lower temperature ortogether with the melting of the first alloy solder powders. In someembodiments, the mixed alloy powder pastes include two or more alloypowders and a flux. The alloy powders in the paste are composed of onesolder alloy powder as a majority and an additive alloy powder as aminority. The additives provide the superior chemistry to wet on variousmetallization surface finishes of the substrates, namely the commonlyused Cu and Ni surface finishes, etc.

In some embodiments, the additives will melt before or together with themelting of the majority solder. The molten additives will wet on andadhere to the substrate before or together with the partially orcompletely molten first alloy. The additives are designed to dominatethe formation of IMCs along the substrate metallization surface finishand be completely converted into IMCs during the reflow process. Thethickness of the IMC layer will thus be well controlled by the quantityof the additives in the paste because of the dominant roles theadditives play in the IMC formation. In some embodiments, the firstalloy solder will have a strong affinity to the IMC layer formed betweenthe additives and the substrate. This strong affinity will enhance thebonding strength between the solder body and the IMCs. Thus, the desiredreaction chemistry and the well controlled thickness of the IMC layernot only improves the wetting performance but also enhances the bondingstrength associated with the wetting performance.

Other features and aspects of the invention will become apparent fromthe following detailed description, taken in conjunction with theaccompanying drawings, which illustrate, by way of example, the featuresin accordance with embodiments of the invention. The summary is notintended to limit the scope of the invention, which is defined solely bythe claims attached hereto.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention, in accordance with one or more variousembodiments, is described in detail with reference to the followingfigures. The drawings are provided for purposes of illustration only andmerely depict typical or example embodiments of the invention. Thesedrawings are provided to facilitate the reader's understanding of theinvention and shall not be considered limiting of the breadth, scope, orapplicability of the invention. It should be noted that for clarity andease of illustration these drawings are not necessarily made to scale.

FIG. 1 illustrates a reflow solder process implemented in accordancewith an embodiment of the invention.

FIG. 2 shows the wetting performance of an example solder pasteconsisting of 90 wt % Bi10.02Ag3.74Sn+10 wt % flux on a Cu coupon and anAlloy 42 coupon.

FIG. 3 shows the wetting performance of an example of the mixed alloypowder solder paste consisting of 84 wt % Bi11Ag+6 wt % Bi42Sn+10 wt %flux on a Cu coupon and an Alloy 42 coupon.

FIG. 4 shows the wetting performance of an example of the mixed alloypowder solder paste consisting of 84 wt % Bi11Ag+6 wt %52In48Sn+10 wt %flux on a Cu coupon and an Alloy 42 coupon.

FIG. 5 is a DSC chart for a mixed alloy powder solder paste consistingof 84 wt % Bi11Ag+6 wt % Sn15Sb+10 wt % flux.

FIG. 6 is a DSC chart for a mixed alloy powder solder paste consistingof 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10 wt % flux.

FIG. 7 is a DSC chart for a mixed alloy powder solder paste consistingof 84 wt % Bi11Ag+6 wt % Bi42Sn+10 wt % flux.

FIGS. 8A and B are cross-section images of the joints made of a mixedalloy powder solder paste on Cu and Ni coupons. The mixed alloy powderpaste consists of 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10 wt % flux.

The figures are not intended to be exhaustive or to limit the inventionto the precise form disclosed. It should be understood that theinvention can be practiced with modification and alteration, and thatthe invention be limited only by the claims and the equivalents thereof.

DETAILED DESCRIPTION OF THE EMBODIMENTS OF THE INVENTION

The present invention is directed towards solder pastes comprisingmixtures of different solder alloys in flux. Two or more solder alloysor metals are incorporated into a flux material. A first solder alloy ormetal (the “first alloy”) will form the main body of the solder jointduring reflow. The remaining second solder alloy or metal, or furtheradditional solder alloys or metals, (the “second alloy”) is selectedaccording to reaction chemistry with the metal substrate or affinity tothe first alloy. The second alloy's melting temperature Tm(B) is lowerthan the first alloy's melting temperature Tm(A). During reflow, thesecond alloy melts first, and spreads onto the substrate. When the firstalloy melts, the presence of the second alloy facilitates the setting ofthe molten first alloy on the substrate. The second alloy is designed tobe completely converted into IMCs, resulting in minimal or absentlow-melting phase in the final joint.

The additives in the pastes modify the reaction chemistry during reflow,improve the wetting, control the thickness of IMCs, and thus enhance thebonding strength. In addition to solders for high temperature lead-freesoldering with the desired wetting and the reliability, the designprocess can be extended into many other soldering applications wherevera poor wetting solder is in use. For example, Pb—Cu alloys have a highmelting temperature but poor wetting on various metal substrates. Thus,they are difficult to use in soldering. With the current invention,small additives, such as Sn or Sn-containing alloys, will help Pb—Cu towet various metal surfaces. However, if the Sn were merely alloyed inPb—Cu, the Cu6Sn5 IMC formation would decrease the reaction chemistryfrom Sn. Alloying higher amounts of Sn in the solder will significantlydecrease the melting temperature of Pb—Cu, which is undesired.

FIG. 1 illustrates a reflow process using a mixed solder paste accordingto an embodiment of the invention. The mixed solder paste comprisesfirst alloy solder particles 118 and second alloy solder particles 115suspended in a flux. In some embodiments, the second alloy is selectedaccording to its superior reaction chemistry to the substrate, or to arange of common substrates. The mixed solder paste is applied to asubstrate 124. (For sake of explanation, the flux is omitted from thefigure.)

During reflow, the temperature of the assembly rises above the secondalloy's melting temperature, Tm(B). The second alloy melts and spreads112 over the substrate 124 and around the still-solid first alloyparticles 118. The superior surface reaction chemistry of the secondalloy will facilitate the wetting of the molten solder alloy 112 on thesubstrate 124. This leads to the formation of IMC layer 109 between themolten second alloy 112 and the substrate 124. Accordingly, the IMClayer is mainly controlled by the quantity of the second alloy 115 inthe initial paste.

Additionally, the second alloy is designed to have a good affinity tothe first alloy. This affinity may be determined by (1) the negativemixing enthalpy between the first alloy and the second alloy, or (2) theformation of a eutectic phase composed of the constituent elements fromthe first and second alloys. In some embodiments, this affinity resultsin some of the first alloy 118 dissolving into the molten second alloy112 to form a mixture 106 of the first and second alloys.

As the temperature rises above the first alloy's melting temperature,Tm(A), the first alloy finishes melting, forming a solution 103 of thefirst and second alloys, which wets to the IMC layer 109. As theassembly is maintained above Tm(A), the second alloy is removed from thesolution 103, increasing the IMC layer 109, and leaving the molten firstalloy 100. In some embodiments, in addition to forming the IMC layer109, excess constituents from the second alloy may be incorporated intoIMC with constituents from the first alloy. The affinity between thefirst alloy and the second alloy assists in improving the wetting of thefirst alloy 100 onto the IMC layer 109, thereby enhancing the bondingstrength.

As the assembly is cooled, a solder bump 121 or joint is formed of thesubstrate 124 bonded to the IMC 109, which is bonded to the solidifiedfirst alloy. After solidification, a homogenous solder joint with theimproved bonding interface has been achieved.

The solder joint resulting from use of the mixed solder paste showslarge improvements of the use of a solder paste containing a singlesolder alloy, even when the single solder alloy is composed of theelements of the first and second solder alloys. FIG. 2 illustratessolder bumps 201 and 207 formed using a solder paste consisting of 90 wt% Bi10.02Ag3.74Sn+10 wt % flux on a Cu substrate 200 and an Alloy 42substrate 205, respectively. As these results show, significantdewetting 202 and 206 occurs with the use of a single solder alloy. Incontrast FIG. 3 illustrates solder bumps 211 and 216 formed using amixed solder paste consisting of 84 wt % Bi11Ag+6 wt % Bi42Sn+10 wt %flux on a Cu substrate 210 and an Alloy 42 substrate 215, respectively.As these results show, the use of a mixed solder paste shows little tono visible dewetting.

In one embodiment, the mixed solder paste comprises BiAg as the firstalloy and SnSb as the second alloy. In the second alloy, Sn is chosenfor its superior reaction chemistries over Bi with various substrates.SnSb has a lower melting temperature than BiAg. Sn and Bi exhibit anegative mixing enthalpy and form the eutectic phase in a widecomposition range, according to the binary phase diagram. Sb and Bi alsoshow a negative mixing enthalpy and infinite solubility to each other.During reflow, SnSb melts first and forms a Sn-containing IMC layer onthe substrate surface. When the temperature reaches above the meltingtemperature of BiAg, all alloy powders in the paste melt. The goodaffinity between Bi and Sn/Sb guarantees good adhesion of molten Bi onthe Sn-containing IMC layer. Additionally, the existence of Ag in thefirst alloy can convert any extra Sn into Ag3Sn IMCs residing in thesolder body. Therefore, there is minimal or no low melting BiSn phaseleft because Sn is completely consumed by forming (1) IMC layer betweenthe solder and the metal substrate and (2) Ag3Sn inside the BiAg solderbump.

FIG. 5 illustrates a DSC curve for the joint resulting from the use of84 wt % Bi11Ag+6 wt % Sn15Sb+10 wt % flux. The top curve illustrates theheat flow profile after reflow on a ceramic coupon. A spike at around138° C. illustrates the presence of the second alloy. The bottom curveillustrates the heat flow profile of the paste after reflow on a Cucoupon. The absence of this spike in the bottom curve verifies thedisappearance of the low melting phase in the BiAg+SnSb system. FIG. 6illustrates the disappearance of the low melting phase in the BiAg+SnAgsystem. The experiment of FIG. 6 used 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10wt % flux on ceramic and Cu coupons, as in FIG. 5. FIG. 7 illustratesthe disappearance in the BiAg+BiSn system. The experiment of FIG. 7 used84 wt % Bi11Ag+6 wt % Bi42Sn+10 wt % flux on ceramic and Cu coupons, asin FIGS. 5 and 6. In FIG. 7, the top curve, illustrating the heat flowprofile after solder reflow on ceramic shows a lack of low meltingphase. This is likely due the small quantity of the reactive agent, Sn,in the mixed solder paste and the high affinity between Sn and Ag,resulting in the Sn of the second alloy being incorporated with some Agof the first alloy into IMC in the final solder bump.

FIG. 8A is a micrograph of a solder joint resulting from use of a mixedsolder paste consisting 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10 wt % flux. Inthis example, the mixed solder paste was applied to a Cu coupon 300. AnIMC 301 forms between the Cu 300 and the second alloy. The size of thisIMC 301 is dependent primarily on the amount of second alloy in thepaste. In the illustrated example, 6 wt % of the second alloy Sn3.5Agresulted in an IMC that is only a few microns thick. The bulk of thesolder joint is made up of Ag 303 in a Bi-rich phase 302. Aging at 150°C. for 2 weeks did not significantly increase the IMC thickness. Incontrast, Bi and Cu do not form intermetallics, so Bi11Ag alone forms aweak bond because no IMC layer is presented between the solder andsubstrate.

In one embodiment of the invention, a method of designing a mixed solderpaste comprises selecting a first alloy according to a desired trait ofa finished solder joint, and then selecting a second alloy according toapplicable substrates and affinity with the selected first alloy. Therelative amounts of the first alloy, second alloy, and flux may bedetermined according to factors such as desired IMC layer thickness,required application conditions, and reflow processes. The IMC layerthickness is related to amount of second alloy in the solder paste, thereflow profile, and the aging conditions following application.Acceptable thicknesses of IMC layer may very with different applicationconditions and different IMC compositions. For example, for a Cu6Sn IMClayer, 10 microns may be about as thick as is acceptable.

As the amount of second alloy in the paste is increased, there may below melting phase remaining gin the final joint. If the amount of secondalloy is reduced in the solder paste, desired wetting performance may bedifficult to achieve. As the amount of second alloy is reduced, goodwetting requires the use of a larger total amount of paste printed ordispensed on the substrate. However, increasing the total amount ofpaste may interfere with the geometry constraints from the solderingpackages.

For high temperature solder applications, the first alloy must be chosenfrom various high melting solder alloys. In some embodiments, Bi-richalloys, whose solidus temperature is around 258° C. and above, i.e.Bi—Ag, Bi—Cu, and Bi—Ag—Cu, are used. The second alloys (or additives)are selected from the alloys that have shown superior chemistry to weton and adhere to various metallization surface finishes and goodaffinity to the molten Bi.

In these embodiments, the second alloy will melt before or together withthe Bi-rich alloys and then easily wet on and adhere to the substrate.Meanwhile, the good affinity between Bi and the second alloy willprovide good wetting. Accordingly, Sn, Sn alloys, In and In alloys arechosen to be the second alloy. On basis of the melting temperature ofthe chosen second alloys, three groups have been categorized. Group Aincludes the additive alloys with the solidus temperature between around230° C. and 250° C., i.e. Sn, Sn—Sb, Sn—Sb—X (X=Ag, Al, Au, Co, Cu, Ga,Ge, In, Mn, Ni, P, Pd, Pt and Zn) alloys etc. Group B contains thesolder alloys with the solidus temperature between around 200° C. and230° C., including Sn—Ag, Sn—Cu, Sn—Ag—X (X=Al, Au, Co, Cu, Ga, Ge, In,Mn, Ni, P, Pd, Pt, Sb and Zn) and Sn—Zn alloys etc. Group C has thesolder alloys with solidus temperature lower than 200° C., i.e. Sn—Bi,Sn—In, Bi—In, In—Cu, In—Ag and In—Ag—X (X=Al, Au, Bi, Co, Cu, Ga, Ge,Mn, Ni, P, Pd, Pt, Sb, Sn and Zn) alloys etc. In these alloys, Sn is thereactive agent in the system.

In one embodiment of the invention, the first alloy is an alloy from theBi—Ag system and has a solidus temperature around 260° C. and above. Ina particular embodiment, the first alloy comprises from 0 to 20 wt % Agwith the remainder being Bi. In a further embodiment, the first alloycomprises from 2.6 to 15 wt % Ag with the remainder being Bi.

In a second embodiment of the invention, the first alloy is selectedfrom the Bi—Cu system and has a solidus temperature around 270° C. andabove. In a particular embodiment, the first alloy comprises from 0 to 5wt % Cu with the remainder being Bi. In a further embodiment, the firstalloy comprises from 0.2 to 1.5 wt % of Cu with the remainder being Bi.

In a third embodiment of the invention, the first alloy is selected fromthe Bi—Ag—Cu system and has a solidus temperature around 258° C. andabove. In a particular embodiment, the first alloy comprises from 0 to20 wt % Ag and from 0 to 5 wt % Cu with the remainder being Bi. In afurther embodiment, the first alloy comprises from 2.6 to 15 wt % Ag,and from 0.2 to 1.5 wt % Cu with the remainder being Bi.

In a fourth embodiment of the invention, the second alloy is from theSn—Sb system and has a solidus temperature between around 231° C. andaround 250° C. In a particular embodiment, the second alloy comprisesfrom 0 to 20 wt % Sb with the remainder of Sn. In a further embodiment,the second alloy comprises of from 0 to 15 wt % Sb with the remainderbeing Sn.

In a fifth embodiment of the invention, the second alloy comprisesSn—Sb—X (where X=Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt andZn) and has a solidus temperature between about 230° C. and about 250°C. In a particular embodiment, the second alloy comprises from 0 to 20wt % Sb and from 0-20 wt % of X with the remainder being Sn. In afurther embodiment, the second alloy comprises from 0 to 10 wt % Sb andfrom 0 to 5 wt % X with the remainder being Sn.

In a sixth embodiment of the invention, the second alloy comprises Sn—Agand has a solidus temperature around 221° C. and above. In a particularembodiment the second alloy comprises from 0 to 10 wt % Ag with theremainder being Sn. In a further embodiment, the second alloy comprisesfrom 0 to 5 wt % Ag with the remainder being Sn.

In a seventh embodiment of the invention, the second alloy comprisesSn—Cu and has a solidus temperature around 227° C. and above. In aparticular embodiment, the second alloy comprises from 0 to 5 wt % Cuwith the remainder being Sn. In a further embodiment, the second alloycomprises from 0 to 2 wt % Cu with the remainder being Sn.

In an eighth embodiment of the invention, the second alloy comprisesSn—Ag—X (where X=Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb andZn) and has a solidus temperature around 216° C. and above. In aparticular embodiment, the second alloy comprises from 0 to 10 wt % Agand from 0 to 20 wt % X with the remainder being Sn. In a furtherembodiment, the second alloy comprises from 0 to 5 wt % Ag and from 0 to5 wt % X with the remainder being Sn.

In a ninth embodiment of the invention, the second alloy comprises Sn—Znand has a solidus temperature around 200° C. and above. In a particularembodiment, the second alloy comprises from 0 to 20 wt % Zn with theremainder being Sn. In a further embodiment, the second alloy comprisesfrom 0 to 9 wt % Zn with the remainder being Sn.

In a tenth embodiment of the invention, the second alloy comprises aBi—Sn alloy with solidus temperature around 139° C. and above. In aparticular embodiment, the second alloy comprises from 8 to 80 wt % Snwith the remainder being Bi. In a further embodiment, the second alloycomprises from 30 to 60 wt % Sn with the remainder being Bi.

In an eleventh embodiment of the invention, the second alloy comprises aSn—In alloy with solidus temperature around 120° C. and above. In aparticular embodiment, the second alloy comprises from 0 to 80 wt % Inwith the remainder being Sn. In a further embodiment, the second alloycomprises from 30 to 50 wt % In with the remainder being Sn.

In a twelfth embodiment of the invention, the second alloy comprises aBi—In alloy with solidus temperature between around 100 and around 200°C. In a particular embodiment, the second alloy comprises from 0 to 50wt % In with the remainder being Bi. In a particular embodiment, thesecond alloy comprises from 20 to 40 wt % In with the remainder beingBi.

In a thirteenth embodiment of the invention, the second alloy comprisesan In—Cu alloy with solidus temperature between around 100 and around200° C. In a particular embodiment, the second alloy comprises from 0 to10 wt % Cu with the remainder being In. In a particular embodiment, thesecond alloy comprises from 0 to 5 wt % Cu with the remainder being In.

In a fourteenth embodiment of the invention, the second alloy comprisesan In—Ag alloy with solidus temperature between around 100 and around200° C. In a particular embodiment, the second alloy comprises from 0 to30 wt % Ag with the remainder being In. In a further embodiment, thesecond alloy comprises from 0 to 10 wt % Ag with the remainder being In.

In a fifteenth embodiment, the second alloy is an In—Ag—X (X=Al, Au, Bi,Co, Cu, Ga, Ge, Mn, Ni, P, Pd, Pt, Sb, Sn and Zn) alloy with a solidustemperature between around 100 and around 200° C. In a furtherembodiment, the second alloy comprises from 0 to 20 wt % Ag, 0 to 20 wt% X with the remainder being In. In a particular embodiment, the secondalloy comprises from 0 to 10 wt % Ag, 0 to 5 wt % X with the remainderbeing In.

Further embodiments of the invention provide methods for making mixedsolder pastes. In some embodiments, particles of the first alloy areformed and particles of the second alloy are formed. The particles ofthe first and second alloys are then mixed with a flux to form a solderpaste. The final paste comprises the first alloy powder, the secondalloy powder, with the balance flux. In some embodiments, the firstalloy particles are of an alloy having a solidus temperature of at leastabout 260° C. In further embodiments, the second alloy comprises analloy having a solidus temperature between about 230° C. and about 250°C., an alloy having a solidus temperature between about 200° C. andabout 230° C., or an alloy having a solidus temperature below about 200°C. In some embodiments, the paste is composed of between about 60 andabout 92 wt % of the first alloy powder, an amount of the second alloypowder greater than 0% but less than or equal to about 12 wt %, with thebalance being flux. In further embodiments, the second alloy powder isbetween 2 and 10 wt % of the mixed solder paste.

In a particular embodiment, the first alloy comprises a Bi—Ag alloy, aBi—Cu alloy, or a Bi—Ag—Cu alloy. In a further embodiment, the alloyhaving a solidus temperature between about 230° C. and about 250° C.comprises an Sn alloy, a Sn—Sb alloy, or an Sn—Sb—X (where X=Ag, Al, Au,Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt and Zn) alloy. In anotherembodiment, the alloy having a solidus temperature between about 200° C.and about 230° C. comprises a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—X(where X=Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb and Zn)alloy, or a Sn—Zn alloy. In a still further embodiment, the alloy havinga solidus temperature below about 200° C. comprises a Sn—Bi alloy, aSn—In alloy, or a Bi—In alloy.

In further embodiments, the second alloy powder comprises a powdercomposed of a plurality of alloy powders. For example, the second alloypowder may comprise a mix of different alloys selected from the alloysdescribed herein.

In some embodiments, the relative amounts of the first and second alloysin the mixed solder pastes are determined according to the solderapplication. In some cases, when the amount of second solder alloy inthe paste is increased past a certain threshold, the chances ofretaining some low melting phase in the final solder joint may beincreased. In some cases, when the amount of second solder alloy in thepaste is below a certain threshold, the wetting to substrate may bereduced. In one embodiment, the amount of second solder alloy in thepaste is determined such that the low melting phase may be completelyconverted into high melting IMCs after reflow. In a further embodiment,the second alloy in the paste varies between an amount greater than Owt% but less than about 12 wt %. In a particular embodiment, the secondalloy in paste is greater than about 2 wt % but less than about 10 wt %.

In addition to various normal impurities or small amounts of differentelements, other elements may be added or incorporated in these alloys aslong as the reactive properties of the Sn are maintained.

In some embodiments, the reflow profile used for soldering with a mixedsolder paste is designed to heat up quickly to above the meltingtemperature of the first alloy. In these cases, a shorter soaking timeat low temperature may allow the reactive agent, such as Sn, to flowquickly toward the substrate and react with the substrate in acompletely melted pool rather than a semisolid melted pool. The meltingof both first and second alloy will facilitate the diffusion of thesecond alloy elements from the molten solder towards the substrate andthe part and “sink” onto the surface to form the IMC layer

EXAMPLE

Various mixed alloy powder solder pastes that span the ranges describedherein, were tested for solder performance.

Table 1 describes formulations of example mixed solder pastes made usinga first alloy comprising Bi11Ag or Bi2.6Ag, a second alloy comprisingSn10Ag25Sb or Sn10Ag10Sb, and flux.

TABLE 1 Weight percentages of mixed solder alloys using Group A secondalloys Bi11Ag Bi2.6Ag Sn10Ag25Sb Sn10Ag10Sb Sn15Sb Flux 80 wt % 10 wt % 10 wt % 82 wt % 8 wt % 10 wt % 84 wt % 6 wt % 10 wt % 86 wt % 4 wt % 10wt % 42 wt % 42 wt % 6 wt % 10 wt % 86 wt % 4 wt % 10 wt % 84 wt % 6 wt% 10 wt % 86 wt % 4 wt % 10 wt %

Table 2 describes formulations of example mixed solder pastes made usinga first alloy comprising Bi11Ag, a second alloy comprising Sn3.8Ag0.7Cu,Sn3.5Ag, Sn0.7Cu, or Sn9Zn, and flux.

TABLE 2 Weight percentages of mixed solder alloys using Group B secondalloys Bi11Ag Sn3.8Ag0.7Cu Sn3.5Ag Sn0.7Cu Sn9Zn Flux 84 wt % 6 wt % 10wt % 86 wt % 4 wt % 10 wt % 84 wt % 6 wt % 10 wt % 86 wt % 4 wt % 10 wt% 84 wt % 6 wt % 10 wt % 86 wt % 4 wt % 10 wt % 84 wt % 6 wt % 10 wt %86 wt % 4 wt % 10 wt %

Table 3 describes formulations of example mixed solder pastes made usinga first alloy comprising Bi11Ag, a second alloy comprising Bi42Sn,Bi33In, or In48Sn, and flux.

TABLE 3 Weight percentages of mixed solder alloys using Group C secondalloys Bi11Ag Bi42Sn Bi33In In48Sn Flux 82 wt % 8 wt % 10 wt % 84 wt % 6wt % 10 wt % 86 wt % 4 wt % 10 wt % 82 wt % 8 wt % 10 wt % 84 wt % 6 wt% 10 wt % 86 wt % 4 wt % 10 wt % 82 wt % 8 wt % 10 wt % 84 wt % 6 wt %10 wt % 86 wt % 4 wt % 10 wt %

Each paste described by Tables 1, 2, and 3, was prepared and printedonto a coupon using a three-hole stainless steel stencil. Cu, Ni, Alloy42, and Alumina coupons were used. Each paste was printed onto eachcoupon. The holes were ¼ inch in diameter. The printed coupons werereflowed through a reflow oven with a profile designed for the mixedalloy powder solder pastes. The reflow was performed in a three-zonereflow oven, at 380° C., 400° C., and 420° C. at a belt speed of 13″ perminute under an N₂ atmosphere.

The wetting performance on the Cu and Ni coupons was visually inspected.All of the mixed solder alloys showed improved wetting when compared toa single BiAg solder paste. FIGS. 3 and 4 are pictures that arerepresentative of typical results. FIG. 3 shows the wetting performanceof an example of the mixed alloy powder solder paste consisting of 84 wt% Bi11Ag+6 wt % Bi42Sn+10 wt % flux. The left image shows the pastereflowed on a Cu coupon; the right image shows the paste reflowed on anAlloy 42 coupon. FIG. 4 shows the wetting performance of an example ofthe mixed alloy powder solder paste consisting of 84 wt % Bi11Ag+6 wt%52In48Sn+10 wt % flux. The left image shows the paste reflowed 401 on aCu coupon 400; the right image shows the paste reflowed 402 on an Alloy42 coupon 405.

The reflowed solder balls were peeled off from the alumina coupons forDSC testing. The solder bumps formed on the Cu coupons and Ni couponswere also punched off for DSC testing. DSC measurement was carried outusing a differential scanning calorimeter at a heating rate of 10°C./min. The representative DSC curves are shown in FIGS. 5-7. FIG. 5illustrates a DSC curve for the joint resulting from the use of 84 wt %Bi11Ag+6 wt % Sn15Sb+10 wt % flux. The top curve illustrates the heatflow profile after reflow on a ceramic coupon. A spike at around 138° C.illustrates the presence of the second alloy. The bottom curveillustrates the heat flow profile of the paste after reflow on a Cucoupon. The absence of this spike in the bottom curve verifies thedisappearance of the low melting phase in the BiAg+SnSb system. FIG. 6illustrates the disappearance of the low melting phase in the BiAg+SnAgsystem. The experiment of FIG. 6 used 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10wt % flux on ceramic and Cu coupons, as in FIG. 5. FIG. 7 illustratesthe disappearance in the BiAg+BiSn system. The experiment of FIG. 7 used84 wt % Bi11Ag+6 wt % Bi42Sn+10 wt % flux on ceramic and Cu coupons, asin FIGS. 5 and 6. In FIG. 7, the top curve, illustrating the heat flowprofile after solder reflow on ceramic shows a lack of low meltingphase. This is likely due to high affinity between Sn and Ag, resultingin the Sn of the second alloy being incorporated into IMC in the finalsolder bump.

Cross sections of samples were imaged to determine the IMC thickness atthe interface between the solder bump and the Cu or Ni coupon. Therepresentative images are shown in FIG. 8. FIG. 8 a is a cross sectionof a solder bump using 84 wt % Bi11Ag+6 wt % Sn3.5Ag+10 wt % flux on aCu coupon. FIG. 8 b is a cross section of a solder bump using the samesolder paste on a Ni coupon. As these results show, the IMC layerthickness was restricted to a few μm on both coupons.

While various embodiments of the present invention have been describedabove, it should be understood that they have been presented by way ofexample only, and not of limitation. Likewise, the various diagrams maydepict an example architectural or other configuration for theinvention, which is done to aid in understanding the features andfunctionality that can be included in the invention. The invention isnot restricted to the illustrated example architectures orconfigurations, but the desired features can be implemented using avariety of alternative architectures and configurations. Indeed, it willbe apparent to one of skill in the art how alternative functional,logical or physical partitioning and configurations can be implementedto implement the desired features of the present invention. Also, amultitude of different constituent module names other than thosedepicted herein can be applied to the various partitions. Additionally,with regard to flow diagrams, operational descriptions and methodclaims, the order in which the steps are presented herein shall notmandate that various embodiments be implemented to perform the recitedfunctionality in the same order unless the context dictates otherwise.

Although the invention is described above in terms of various exemplaryembodiments and implementations, it should be understood that thevarious features, aspects and functionality described in one or more ofthe individual embodiments are not limited in their applicability to theparticular embodiment with which they are described, but instead can beapplied, alone or in various combinations, to one or more of the otherembodiments of the invention, whether or not such embodiments aredescribed and whether or not such features are presented as being a partof a described embodiment. Thus, the breadth and scope of the presentinvention should not be limited by any of the above-described exemplaryembodiments.

Terms and phrases used in this document, and variations thereof, unlessotherwise expressly stated, should be construed as open ended as opposedto limiting. As examples of the foregoing: the term “including” shouldbe read as meaning “including, without limitation” or the like; the term“example” is used to provide exemplary instances of the item indiscussion, not an exhaustive or limiting list thereof; the terms “a” or“an” should be read as meaning “at least one,” “one or more” or thelike; and adjectives such as “conventional,” “traditional,” “normal,”“standard,” “known” and terms of similar meaning should not be construedas limiting the item described to a given time period or to an itemavailable as of a given time, but instead should be read to encompassconventional, traditional, normal, or standard technologies that may beavailable or known now or at any time in the future. Likewise, wherethis document refers to technologies that would be apparent or known toone of ordinary skill in the art, such technologies encompass thoseapparent or known to the skilled artisan now or at any time in thefuture.

The presence of broadening words and phrases such as “one or more,” “atleast,” “but not limited to” or other like phrases in some instancesshall not be read to mean that the narrower case is intended or requiredin instances where such broadening phrases may be absent. The use of theterm “module” does not imply that the components or functionalitydescribed or claimed as part of the module are all configured in acommon package. Indeed, any or all of the various components of amodule, whether control logic or other components, can be combined in asingle package or separately maintained and can further be distributedin multiple groupings or packages or across multiple locations.

Additionally, the various embodiments set forth herein are described interms of exemplary block diagrams, flow charts and other illustrations.As will become apparent to one of ordinary skill in the art afterreading this document, the illustrated embodiments and their variousalternatives can be implemented without confinement to the illustratedexamples. For example, block diagrams and their accompanying descriptionshould not be construed as mandating a particular architecture orconfiguration.

1. A solder paste, consisting of: an amount of a first solder alloypowder between 60 wt % to 92 wt %; an amount of a second solder alloypowder greater than 0 wt % and less than 12 wt %; and flux; wherein thefirst solder alloy powder comprises a first solder alloy that has asolidus temperature above 260° C.; and wherein the second solder alloypowder comprises a second solder alloy that has a solidus temperaturethat is less than 250° C.
 2. The solder paste of claim 1, wherein thesecond solder alloy has a solidus temperature between 230° C. and 250°C.
 3. The solder paste of claim 2, wherein the second solder alloycomprises a Sn alloy, a Sn—Sb alloy, or a Sn—Sb—X (where X=Ag, Al, Au,Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, or Zn) alloy.
 4. The solder pasteof claim 1, wherein the second solder alloy has a solidus temperaturebetween 200° C. and 230° C.
 5. The solder paste of claim 4, wherein thesecond solder alloy comprises a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—X(where X=Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn)alloy, or a Sn—Zn alloy.
 6. The solder paste of claim 1, wherein thesecond solder alloy has a solidus temperature below 200° C.
 7. Thesolder paste of claim 6, wherein the second solder alloy comprises aSn—Bi alloy, a Sn—In alloy, or a Bi—In alloy.
 8. The solder paste ofclaim 1, wherein the amount of the second solder alloy powder is between2 wt % and 10 wt %.
 9. The solder paste of claim 1, wherein the firstsolder alloy comprises a Bi—Ag, Bi—Cu, or Bi—Ag—Cu alloy.
 10. The solderpaste of claim 1, wherein the first solder alloy comprises from 0 to 20wt % Ag with the remainder being Bi, from 0 to 5 wt % Cu with theremainder being Bi, or from 0 to 20 wt % Ag and from 0 to 5 wt % Cu,with the remainder being Bi.
 11. The solder paste of claim 1, whereinthe first solder alloy comprises from 2.6 to 15 wt % Ag with theremainder being Bi, from 0.2 to 1.5 wt % of Cu with the remainder beingBi, or from 2.6 to 15 wt % Ag, and from 0.2 to 1.5 wt % Cu with theremainder being Bi.
 12. The solder paste of claim 1, wherein the secondsolder comprises a Sn—Sb—X alloy or a Sn—Ag—X alloy.
 13. The solderpaste of claim 1, wherein the second solder alloy comprises a reactivecomponent that reacts with a substrate to form an interfacialintermetallic compound layer.
 14. The solder paste of claim 13, whereinthe second solder alloy further comprises a second component that has anegative mixing enthalpy with components of the first solder alloy. 15.The solder paste of claim 13, wherein the reactive component is presentin an amount such that, after reflow, the reactive component iscompletely consumed into the interfacial intermetallic compound layer,or is completely consumed into the interfacial intermetallic compoundlayer and one or more additional intermetallic compounds inside a joint.16. The solder paste of claim 13, wherein the first solder alloy has agreater wettability to the interfacial intermetallic compound layer thanthe first solder alloy has to the substrate.
 17. The solder paste ofclaim 13, wherein, during reflow, the interfacial intermetallic compoundlayer forms after the second solder starts to melt and before theformation of one or more additional intermetallic compounds inside ajoint.
 18. A method of making a solder paste, consisting of combining:an amount of a first solder alloy powder between 60 wt % to 92 wt %; andan amount of a second solder alloy powder greater than 0 wt % and lessthan 12 wt %; with flux; wherein the first solder alloy powder comprisesa first solder alloy that has a solidus temperature above 260° C.; andwherein the second solder alloy powder comprises a second solder alloythat has a solidus temperature that is less than 250° C.
 19. The methodof claim 18, wherein the second solder alloy comprises a Sn alloy, aSn—Sb alloy, a Sn—Sb—X (where X=Ag, Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni,P, Pd, Pt, or Zn) alloy, a Sn—Ag alloy, a Sn—Cu alloy, a Sn—Ag—X (whereX=Al, Au, Co, Cu, Ga, Ge, In, Mn, Ni, P, Pd, Pt, Sb, or Zn) alloy, aSn—Zn alloy, a Sn—Bi alloy, a Sn—In alloy, or a Bi—In alloy.
 20. Themethod of claim 18, wherein the amount of the second solder alloy powderis between 2 wt % and 10 wt %.
 21. The method of claim 18, wherein thefirst solder alloy comprises a Bi—Ag, Bi—Cu, or Bi—Ag—Cu alloy.
 22. Themethod of claim 18, wherein the first solder alloy comprises from 0 to20 wt % Ag with the remainder being Bi, from 0 to 5 wt % Cu with theremainder being Bi, or from 0 to 20 wt % Ag and from 0 to 5 wt % Cu,with the remainder being Bi.
 23. The method of claim 18, wherein thefirst solder alloy comprises from 2.6 to 15 wt % Ag with the remainderbeing Bi, from 0.2 to 1.5 wt % of Cu with the remainder being Bi, orfrom 2.6 to 15 wt % Ag, and from 0.2 to 1.5 wt % Cu with the remainderbeing Bi.
 24. The method of claim 18, wherein the second soldercomprises a Sn—Sb—X alloy or a Sn—Ag—X alloy.
 25. The method of claim18, wherein the second solder alloy comprises a reactive component thatreacts with a substrate to form an interfacial intermetallic compoundlayer.
 26. The method of claim 25, wherein the second solder alloyfurther comprises a second component that has a negative mixing enthalpywith components of the first solder alloy.
 27. The method of claim 25,wherein the reactive component is present in an amount such that, afterreflow, the reactive component is completely consumed into theinterfacial intermetallic compound layer, or is completely consumed intothe interfacial intermetallic compound layer and one or more additionalintermetallic compounds inside a joint.
 28. The method of claim 25,wherein the first solder alloy has a greater wettability to theinterfacial intermetallic compound layer than the first solder alloy hasto the substrate.
 29. The method of claim 25, wherein, during reflow,the interfacial intermetallic compound layer forms after the secondsolder starts to melt and before the formation of the one or moreadditional intermetallic compounds inside a joint.